Dicing Chuck Table main features

Dicing Chuck Table makes optimum condition for Dicing Saw, Laser Dicing, Laser marketing, Grooving.

Wafer back grinding and Wafer mounting which requires high degree of flatness by optimizing in whole side adsorption or partial adsorption and fixing when do precision machining, clean, and move difficult-to-cut-material such as Silicon wafer, PCB, Glass, Ceramic and QFN using vesicular ceramic porous of alumina line.

Mainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the processes of thinning, dicing, cleaning, transportation and so on.

Some of our quality advantages:

  1. There are pores between the particles to maintain gas permeability.
  2. Even in the case of very thin workpiece, it is possible to maintain smooth and precise machining and measurement.
  3. Even in the case of very thin workpiece, it is possible to maintain smooth and precise machining and measurement.
  4. High precision uniform porosity and adsorption force will not cause the workpiece to sag.
  5. Suitable for any film workpiece.
  6. Good surface precision and surface flatness up to 0.5um.

Round chuck table

LY no/DIM(mm)
Inch
Flatness
CPC-SS-06
6″
0.003 MAX
CPC-SS-08
8″
0.003 MAX
CPC-SS-12
12″
0.005 MAX

Dicing Chuck Table(다이 싱 척 테이블/ダイシングチャックテーブル) makes optimum condition for Dicing Saw, Laser Dicing, Laser marketing, Grooving, Wafer back grinding and Wafer mounting which requires high degree of flatness by optimizing in whole side adsorption or partial adsorption and fixing when do precision machining, clean, and move difficult-to-cut-material such as Silicon wafer, PCB, Glass, Ceramic and QFN using vesicular ceramic porous of alumina line. Mainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the processes of thinning, dicing, cleaning, transportation and so on

In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.

8 Inch Rectangle chuck table

LY no/DIM(mm)
Inch
Flatness
CPC-FS-XX
8″
0.003 MAX

Antistatic

This series of antistatic surface treatments is specially developed for the wafer semiconductor industry to reduce the damage caused by static electricity during wafer manufacturing package testing, such as metal, ceramics, plastic (excluding Teflon and tantalum rubber). , quartz, etc., the finished product has high anti-static, high anti-wear, high temperature and other characteristics.

Anti-stick

This series of anti-adhesive surface treatment is specially developed for various types of porous suction cups, molds, placing platforms and various transfer heads in the process. Eslite has excellent anti-adhesion and anti-dust accumulation after surface treatment. Reduce the defect rate and fragmentation loss caused by adhesive in the process.

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