Chip Bonding Tools main features

Chip Bonding Tools ultra-small single Pin and multi-Pin needles can quickly match the development of customers’ various wafer solid-crystal dispensing processes, which has the advantage of winning market opportunities.

The needle and the needle can meet the installation and product use of different equipments of the customer, so that the appropriate amount of glue is attached to the Bond area of the substrate, so that the wafer can be smoothly adhered.

The LONGYI technical team is an industry leader in precision ceramic forming and processing technology.
The main process features include:

  1. Precision micro hole processing size 0.08-3mm.
  2. Precision outer ring and plane grinding.
  3. Technical processes such as microgroove processing of ceramic substrates.
Type
ID(mm)
OD(mm)
VR
Material
DSP-ZRO-020
0.05
0.20
0.1
Zirconia
DSP-ZRO-025
0.05
0.25
0.1
Zirconia
DSP-ZRO-030
0.05
0.30
0.1
Zirconia
DSP-ZRO-035
0.05
0.35
0.1
Zirconia
DSP-ZRO-040
0.05
0.40
0.1
Zirconia
DSP-ZRO-045
0.10
0.45
0.1
Zirconia
DSP-ZRO-050
0.10
0.50
0.1
Zirconia
DSP-ZRO-055
0.10
0.55
0.1
Zirconia

Compared with metal materials, the ceramic surface is excellent in flatness and pen metal, which is not easy to scratch the product.

Applicable machine model: Die Attach Hitach series/2100 & AC Type 730/800

DSP-Z-2P Die Bonding Stamping Pin

Single-needle dip needles are used in the LED packaging process. Epoxy is dispensed into the substrate holder from the plastic tray, and is superior to various specifications in the industry.

Bonding Stamping Pin is used in the back-end process of bonding.
Its functions include protecting substrate, microcircuit, IC, and preventing the possible damages from dust, moisture, light and other substances that might cause the damages of products.

  • Can do a variety of other functions depending on what specific needs the business requires.
Type
Hole Diameter(mm)

Are used in the back-end process of bonding. Its functions include protecting substrate, microcircuit, IC, and preventing the possible damages from dust, moisture, light and other substances that might cause the damages of products. Can do a variety of other functions depending on what specific needs the business requires.

LED-Die-bonding
Type
Hole Diameter(mm)

LONGYI is one of the leading companies in the LED and semiconductor industry with its high quality and competitive price; we offer

  • Epoxy resin needle
  • Dispensing nozzle
  • Fluid dispensing tool
  • Epoxy dispensing tool
  • Nozzle
  • Dispensing needle
  • Microneedles
  • Stamping tool
  • Picking tool

Our goal is to provide our customers with products of high quality, competitive price and quality service.

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