What We Do
CNC milling machines are machine tools which are used for the shaping of metal and other solid materials.
CNC Wire Cutter
In order to generate an electric spark between two electrodes, the voltage between the two electrodes must be higher than the gap between the electrode and the workpiece…
Advanced Ceramics cover many different and in part highly-specialized ceramic materials with unique mechanical, electrical, thermal and biochemical properties and property
Who We Are?
Longyi Precision Technology was established in 2007, and has led the industry in development and manufacturing of ceramic solutions for a wide range of different fields. As a precision ceramic manufacturer and developer, Longyi specializes in precision ceramic parts, porous vacuum chuck, Die bonding tools, CNC Machining parts, customized tools. Longyi’s extensive experience enables us to manufacture high quality ceramic products that meet the ceramic needs for diversified industries.
Longyi is constantly customer-focused which prepares us to satisfy our customers beyond the expectations. Our products consists application-oriented, perfectly customized, and the quality has been highly approved by our customers for a decade.
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Dicing chuck table LONGYI’s porous ceramics are based on high-quality raw materials of alumina and silicon carbide. For porous ceramics, the microstructure is made up of small crystals called grains. In general, the smaller the grain size, the stronger and denser is the ceramic material. The wide variety of application for porous ceramic materials results from their unique properties. In many aspects,
Quality Management System ISO 9001 : 2015 Development, Manufacturing and Processing of Ceramic, Metal and Non- Metal Materials Used in Electronic Components such as Semiconductors, Packing and Testing, Solar Energy and Biotechnology Medical Equipment Parts. CERTIFICATE NO. : IAS/QMS/C1793 IAS-UIC Number : MSCB-120-9091 ISSUED ON : 21/07/2018
What is Ceramic QFN(leadless chip carriers (LCCs) Ceramic quad flat non-leaded packages (C-QFN). A QFN package allows for attachment and connection of an IC to a PCB without through-hole connections, using surface-mount technology (SMT) for compatibility with PCBs using micro strip and coplanar-waveguide (CPW) transmission-line technologies.
Dispensing nozzles are designed for accurate dispensing of the glue onto the substrate which helps to prevent inconsistent epoxy problems like tailing, bridging, voids and insufficient epoxy coverage. This enables our customers to achieve superior dispensing performance. The complete set of nozzles and adaptors is available for all types of bonders in the market.
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